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Victor M Ma, 56611 Laurel Glen Ter, Fremont, CA 94539

Victor Ma Phones & Addresses

611 Laurel Glen Ter, Fremont, CA 94539   

Hudson, MA   

5642 Strawflower Ln, San Jose, CA 95118    408-2669605   

Champaign, IL   

Brooklyn, NY   

Campbell, CA   

Alameda, CA   

5347 Nordica Ave, Fremont, CA 94536   

Work

Company: Agility - Burlingame, CA May 2012 Position: Business development executive

Education

School / High School: University of California, Berkeley- Berkeley, CA May 2007 Specialities: Bachelor of Arts in Political Economy of Industrial Societies

Mentions for Victor M Ma

Career records & work history

Lawyers & Attorneys

Victor Ma Photo 1

Victor Ma - Lawyer

Office:
Freshfields Bruckhaus Deringer LLP
ISLN:
1000922350
Admitted:
2020

Resumes & CV records

Resumes

Victor Ma Photo 39

Physical Design Architect

Location:
San Francisco, CA
Industry:
Computer Hardware
Work:
Apple
Physical Design Architect
Amd 2010 - Mar 2012
Senior Project Manager
Amd 2005 - 2009
Senior Physical Design Manager
Amd 2003 - 2005
Staff Cad Engineer
Procket Networks 2000 - 2003
Mts
Sequence Design 1997 - 1999
Application Engineer
Avanti 1997 - 1998
Various
Digital Equipment Corp 1992 - 1996
Cad Engineer
Education:
University of Illinois at Urbana - Champaign 1990 - 1992
Master of Science, Masters, Electrical Engineering
Columbia Engineering 1986 - 1990
Bachelors, Bachelor of Science, Electrical Engineering
Skills:
Asic, Physical Design, Eda, Tcl, Formal Verification, Floorplanning, Perl
Victor Ma Photo 40

Victor Ma

Victor Ma Photo 41

U S Postal Letter Carrier

Work:
United States Postal Service
U S Postal Letter Carrier
Victor Ma Photo 42

Victor Ma

Victor Ma Photo 43

Victor Ma

Victor Ma Photo 44

Master's Candidate At San Francisco State University

Location:
San Francisco Bay Area
Industry:
Higher Education
Victor Ma Photo 45

Victor Ma - Fremont, CA

Work:
Agility - Burlingame, CA May 2012 to Aug 2013
Business Development Executive
Air Tiger Express - South San Francisco, CA Mar 2011 to Apr 2012
Sales Executive
East West Bank - San Francisco, CA Aug 2008 to Apr 2010
Portfolio Analyst
East West Bank - San Francisco, CA May 2008 to Aug 2008
Operations Assistant
Education:
University of California, Berkeley - Berkeley, CA May 2007
Bachelor of Arts in Political Economy of Industrial Societies

Publications & IP owners

Us Patents

Integrated Circuit Chip With Repeater Flops And Method For Automated Design Of Same

US Patent:
2008006, Mar 13, 2008
Filed:
Aug 17, 2007
Appl. No.:
11/840660
Inventors:
Stuart Taylor - San Jose CA, US
Victor Ma - Fremont CA, US
Bharat Patel - San Jose CA, US
International Classification:
G06F 17/50
H03K 19/0175
US Classification:
716010000, 326062000
Abstract:
An integrated circuit (IC) chip having repeaters for propagating signals along relatively long wires that extend between and among lower-level physical blocks of the IC chip, wherein the repeaters are implemented as clocked flip-flops (or “repeater flops”). A method for automatically inserting and allocating such repeater flops during the logical and physical design of the IC chip is also provided.

Integrated Circuit Chip With Repeater Flops And Methods For Automated Design Of Same

US Patent:
2012022, Aug 30, 2012
Filed:
Apr 30, 2012
Appl. No.:
13/460747
Inventors:
Stuart A. Taylor - San Jose CA, US
Victor Ma - Fremont CA, US
Bharat Patel - San Jose CA, US
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
G06F 17/50
US Classification:
716114
Abstract:
An integrated circuit (IC) chip having repeaters for propagating signals along relatively long wires that extend between and among lower-level physical blocks of the IC chip, wherein the repeaters are implemented as clocked flip-flops (or “repeater flops”). A method for automatically inserting and allocating such repeater flops during the logical and physical design of the IC chip is also provided.

Compact Metal Connect And/Or Disconnect Structures

US Patent:
2012031, Dec 13, 2012
Filed:
Jun 9, 2011
Appl. No.:
13/156399
Inventors:
Omid Rowhani - Newmarket, CA
Victor M. Ma - Fremont CA, US
International Classification:
H01L 23/522
G06F 17/50
H01L 21/768
US Classification:
257774, 438618, 716 50, 257E23145, 257E21575
Abstract:
Embodiments of present invention provide methods and apparatuses for connecting and/or disconnecting nodes in a semiconductor device. Embodiments of the apparatus may include a plurality of metal layers formed above a substrate and an interconnect structure formed between first and second nodes in the plurality of metal layers. The interconnect structure includes one or more metal lines formed in each of the metal layers. The metal lines are connected by a plurality of vias. Modifying one of the metal lines in any one of the metal layers changes an electrical connection between the first and second nodes.

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